MediaTek announces new Filogic 130 series chips
By MYBRANDBOOK
MediaTek announced the new MediaTek Filogic 130 and Filogic 130A system-on-chips (SoCs) which both integrate a microprocessor (MCU), AI engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, and a power management unit (PMU) into a single chip.
Filogic 130 and Filogic 130A both support 1T1R Wi-Fi 6 connectivity and dual-band 2.4GHz and 5GHz, along with advanced Wi-Fi features such as target wake time (TWT), MU-MIMO, MU-OFDMA, quality of service (QoS) and WPA3 Wi-Fi security.
Filogic 130A also integrates an audio digital signal processor to allow device makers to easily add voice assistants and other services into their products.
The solutions support advanced Wi-Fi and Bluetooth coexistence to ensure that users’ Wi-Fi connectivity remains reliable even when Bluetooth devices are in use at the same time.
It also supports secure boot and hardware crypto engines for robust security capabilities, and support a variety of interfaces including general purpose IOs such as SPI, I2C, I2S, IR input, UART, AUXADC, PWM and GPIO interfaces to make the design process easier.
These all-in-one solutions deliver energy-efficient, reliable and high-performance connectivity in small form factor designs that are ideal for a wide range of IoT devices.
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DELL TECHNOLOGIES INDIA PVT. LTD.
STERLITE TECHNOLOGIES LTD.
AMARA RAJA POWER SYSTEMS LTD.
TVS ELECTRONICS LTD.
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