As AI race heats up, Samsung to use chip-making tech from SK Hynix
By MYBRANDBOOK
Seeking to catch up in the race to produce high-end chips used to power artificial intelligence, Samsung Electronics plans to use a chip making technology championed by rival SK Hynix. The demand for high bandwidth memory (HBM) chips has boomed with the growing popularity of generative AI. Samsung has however been conspicuous by its absence in any deal making with AI chip leader Nvidia to supply latest HBM chips.
While Samsung has fallen behind is its decision to stick with chip making technology called non-conductive film (NCF) because of some production issues, Hynix switched to the mass reflow molded underfill (MR-MUF) method to address NCF’s weakness, according to analysts and industry watchers.
Samsung has now went ahead to issue purchase orders for chipmaking equipment designed to handle MUF technique. The tech giant had to do something to ramp up its HBM (production) yields. According to a source, adopting MUF technique is a little bit of swallow-your-pride type thing for Samsung, because it ended up following the technique first used by SK Hynix.
Samsung said its NCF technology is an “optimal solution” for HBM products and would be used in its new HBM3E chips.
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