Hon’ble Prime Minister Narendra Modi virtually laid the foundation stone for India Chip Private Limited, a joint venture between HCL Group and Foxconn, marking a significant milestone under the India Semiconductor Mission.

The advanced Outsourced Semiconductor Assembly & Test (OSAT) facility will be established in YEIDA, Jewar (Greater Noida), Uttar Pradesh. The ceremony was attended by UP Chief Minister Yogi Adityanath and Union Minister Ashwini Vaishnaw, along with Roshni Nadar Malhotra, Chairperson of HCL Group, and Bob Chen of Foxconn’s Semiconductor Business Group.

India Chip Pvt Ltd is structured as a 60:40 JV between HCL and Foxconn. With an investment of ₹3,700 crore, the OSAT facility is expected to be operational by 2028 and will manufacture display driver chips. The plant is projected to process 20,000 wafers per month, generating over 3,500 direct and indirect jobs while strengthening India’s semiconductor supply chain.

The project reinforces India’s ambition for self-reliance in semiconductor manufacturing and positions Uttar Pradesh as an emerging technology hub. As HCL marks its 50th anniversary, the venture signals a strategic expansion into high-tech manufacturing, combining Foxconn’s global manufacturing scale with HCL’s engineering legacy to build resilient, world-class semiconductor infrastructure in India.